Intel Foveros Technology: Inside Advanced Packaging in New Mexico | Intel

Published on 4 May 2026, 20:00

As AI demands more "brain power" than ever before, the semiconductor industry is evolving, moving past the era of relying on single, massive chips.

Go inside Intel’s Fab 9 in New Mexico where many advanced packaging processes take place—the essential craft of connecting multiple specialized chips together. Using Foveros technology, these individual pieces function as a single, powerful unit that runs faster while handling massive workloads.

For example, Foveros helps laptop batteries last longer by placing power-hungry circuits on more power efficient process nodes. Laptops can become thinner, and edge computing devices can fit into smaller spaces without sacrificing performance. Foveros also allows for more features to be packed into a smaller footprint, from the factory floor to your desk.

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Intel Foveros Technology: Inside Advanced Packaging in New Mexico | Intel
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