The Bring Up: Computex 2021 and Revolutionary 3D Chiplets

Опубликовано 10 июня 2021, 14:00

We Bring Up: Dr. Lisa Su’s keynote at Computex 2021 and discuss AMD’s breakthrough in 3D Chiplet Technology, including why vertical stacking is used and how AMD bonds their chips together. Plus, Bridget makes "Chocolate Chiplet Cookies".

Chapters
01:10 - AMD Computex Keynote Highlights
03:28 - Why 3D Stacking?
05:07 - Oscilloscope Magic
07:40 - Chip Connection Showdown

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