Intentionally Shattering Wafers Inside The Fab | Intel

Опубликовано 19 мая 2015, 18:00

Meet Ryan Parrott, Packaging Engineer at Intel. His job is to design and test the custom packaging solutions used to ship silicon wafers all over the world. In order to learn which solutions work, Ryan has got to push expensive wafers potentially containing thousands of processors to their breaking points.

The packaging used to ship wafers is called a Front-Opening Shipping Box, or FOSB. Each of these specially-designed boxes contain 25 glass-like, silicon wafers totaling $250,000 to multi-million US dollars per box depending on product. Each wafer is incredibly fragile, and it's Ryan's job to insure that each FOSB makes it to its destination with all wafers intact.

Check out Ryan's story, and stay tuned for more stories "Inside the Fab" at Intel.

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Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Founded in 1968 to build semiconductor memory products, Intel introduced the world's first microprocessor in 1971. This decade, our mission is to create and extend computing technology to connect and enrich the lives of every person on Earth.

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Intentionally Shattering Wafers Inside The Fab | Intel
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