Abstracts: Heat Transfer and Deep Learning with Hongxia Hao and Bing Lv
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53 days – 1401:17:21Published on 21 May 2025, 16:32
Silicon has long borne the burden of heat transfer in electronics, but in a post-Moore’s Law world, researchers like Hongxia Hao and Bing Lv are using AI to discover and design next-generation materials that exceed the limits of silicon’s thermal conductivity.
Show notes: microsoft.com/en-us/research/p...
Listen to the Abstracts series: microsoft.com/en-us/research/p...
Show notes: microsoft.com/en-us/research/p...
Listen to the Abstracts series: microsoft.com/en-us/research/p...
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